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design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) e 1 r 2 tj0eg103fm 3 4 5 6 78 9 10 11 12 common code ert j product code type code ntc thermistors chip type (smd) multilayer type size code ?0402??0603? 01 packaging style code ev 1%2% 3% 5% f g h j resistance tolerance code nominal resistance r 25 ( ) the ?rst two digits are signi?cant ?gures of resistance and the third one denotes the number of zeros following them. (example) b value class code 2701 to 28003301 to 3400 3801 to 3900 4001 to 4100 4201 to 4300 4301 to 4400 4401 to 4500 4601 to 4700 a g m p r s t v automotive component ?0402? pressed carrier taping punched carrier taping (pitch : 2 mm) ?0603? punched carrier taping (pitch : 4 mm) narrow tolerance type standard type m 5 4 3 2 1 multilayer ntc thermistors (automotive grade) series: ertj-m explanation of part numbers construction features recommended applications surface mount device (0402, 0603) highly reliable multilayer / monolithic structure wide temperature operating range (?40 to 150 c) environmentally-friendly lead-free aec-q200 quali? ed rohs compliant for car audio system for ecus for electric pumps and compressors for led lights for batteries for temperature detection of various circuits no. name a semiconductive ceramics b internal electrode c terminal electrode substrate electrode d intermediate electrode e external electrode jan. 2018 04 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) ratings 0402(eia) 0603(eia) temperature and resistance value (the resistance value at 25 c is set to 1)/ reference values 1 rated maximum power dissipation : the maximum power that can be continuously app lied at the rated ambient temperature. the maximum value of power, and rated power is same under the condition of ambient te mperature 25 c or less. if the tempera ture exceeds 25 c, rated power depends on the decreased power dissipation curve. please see ?operating power? for details. 2 dissipation factor : the constant amount power required to raise the temperature of the th ermistor 1 c through self heat gener ation under stable temperatures. dissipation factor is the reference value when mounted on a glass epoxy board ( 1.6 mmt). : resistance tolerance code (f : 1%, g : 2%, h : 3%, j : 5%) : resistance tolerance code (f : 1%, g : 2%, h : 3%, j : 5%) size code (eia) 0(0402) 1(0603) operating temperature range ?40 to 150 c rated maximum power dissipation 1 66 mw 100 mw dissipation factor 2 approximately 2 mw/c approximately 3 mw/c r 25 =resistance at 25.00.1 c r 50 =resistance at 50.00.1 c r 85 =resistance at 85.00.1 c b 25/50 = k n (r 25 /r 50 ) 1/298.15?1/323.15 b 25/85 = k n (r 25 /r 85 ) 1/298.15?1/358.15 part number list ertj g to ertj1vk to ertj0ep to ertj1vp to ertj0er to ertj1vr to ertj t to ertj v to b 25/50 (3380 k) 3650 k 4050 k 4100 k 4250 k 4200 k 4485 k 4700 k b 25/85 3435 k (3690 k) (4100 k) (4150 k) (4300 k) (4250 k) (4550 k) (4750 k) t(c) -40 20.52 25.77 33.10 34.56 42.40 40.49 46.47 59.76 -35 15.48 19.10 24.03 24.99 29.96 28.81 32.92 41.10 -30 11.79 14.29 17.63 18.26 21.42 20.72 23.55 28.61 -25 9.069 10.79 13.06 13.48 15.50 15.07 17.00 20.14 -20 7.037 8.221 9.761 10.04 11.33 11.06 12.38 14.33 -15 5.507 6.312 7.362 7.546 8.370 8.198 9.091 10.31 -10 4.344 4.883 5.599 5.720 6.244 6.129 6.729 7.482 -5 3.453 3.808 4.291 4.369 4.699 4.622 5.019 5.481 0 2.764 2.993 3.312 3.362 3.565 3.515 3.772 4.050 5 2.227 2.372 2.574 2.604 2.725 2.694 2.854 3.015 10 1.806 1.892 2.013 2.030 2.098 2.080 2.173 2.262 15 1.474 1.520 1.584 1.593 1.627 1.618 1.666 1.710 20 1.211 1.229 1.255 1.258 1.271 1.267 1.286 1.303 2 511111111 30 0.8309 0.8185 0.8016 0.7994 0.7923 0.7944 0.7829 0.7734 35 0.6941 0.6738 0.6461 0.6426 0.6318 0.6350 0.6168 0.6023 40 0.5828 0.5576 0.5235 0.5194 0.5069 0.5108 0.4888 0.4721 45 0.4916 0.4639 0.4266 0.4222 0.4090 0.4132 0.3896 0.3723 50 0.4165 0.3879 0.3496 0.3451 0.3320 0.3363 0.3123 0.2954 55 0.3543 0.3258 0.2881 0.2837 0.2709 0.2752 0.2516 0.2356 60 0.3027 0.2749 0.2386 0.2344 0.2222 0.2263 0.2037 0.1889 65 0.2595 0.2330 0.1985 0.1946 0.1831 0.1871 0.1658 0.1523 70 0.2233 0.1984 0.1659 0.1623 0.1516 0.1554 0.1357 0.1236 75 0.1929 0.1696 0.1393 0.1359 0.1261 0.1297 0.1117 0.1009 80 0.1672 0.1456 0.1174 0.1143 0.1054 0.1087 0.09236 0.08284 85 0.1451 0.1255 0.09937 0.09658 0.08843 0.09153 0.07675 0.06834 90 0.1261 0.1087 0.08442 0.08189 0.07457 0.07738 0.06404 0.05662 95 0.1097 0.09440 0.07200 0.06969 0.06316 0.06567 0.05366 0.04712 100 0.09563 0.08229 0.06166 0.05957 0.05371 0.05596 0.04518 0.03939 105 0.08357 0.07195 0.05306 0.05117 0.04585 0.04786 0.03825 0.03308 110 0.07317 0.06311 0.04587 0.04415 0.03929 0.04108 0.03255 0.02791 115 0.06421 0.05552 0.03979 0.03823 0.03378 0.03539 0.02781 0.02364 120 0.05650 0.04899 0.03460 0.03319 0.02913 0.03059 0.02382 0.02009 125 0.04986 0.04336 0.03013 0.02886 0.02519 0.02652 0.02043 0.01712 130 0.04413 0.03849 0.02629 0.02513 0.02184 0.02307 0.01755 0.01464 135 0.03916 0.03426 0.02298 0.02193 0.01898 0.02013 0.01511 0.01256 140 0.03483 0.03058 0.02013 0.01918 0.01654 0.01762 0.01304 0.01080 145 0.03105 0.02736 0.01767 0.01680 0.01445 0.01546 0.01127 0.00931 150 0.02774 0.02454 0.01553 0.01476 0.01265 0.01361 0.00976 0.00806 part number nominal resistance at 25 c b value at 25/50(k) b value at 25/85(k) ertj0eg202gm 2 k 2 % (3380 k) 3410 k0.5 % ertj0eg202hm 2 k 3 % (3380 k) 3410 k0.5 % ertj0eg202jm 2 k 5 % (3380 k) 3410 k0.5 % ertj0eg103 m 10 k 3380 k1 % 3435 k1 % ertj0ep473 m 47 k 4050 k1 % (4100 k) ertj0er104 m 100 k 4250 k1 % (4300 k) ertj0et104 m 100 k 4485 k1 % (4550 k) ertj0ev104 m 100 k 4700 k1 % (4750 k) ertj0ev474 m 470 k 4700 k1 % (4750 k) part number nominal resistance at 25 c b value at 25/50(k) b value at 25/85(k) ertj1vk102 m 1 k 3650 k1 % (3690 k) ertj1vg103 m 10 k 3380 k1 % 3435 k1 % ertj1vp473 m 47 k 4100 k1 % (4150 k) ertj1vr104 m 100 k 4200 k1 % (4250 k) ertj1vv104 m 100 k 4700 k1 % (4750 k) ertj1vt224 m 220 k 4485 k1 % (4550 k) jan. 2018 04 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) 1.0 test sample 0.5r 0.5 board 1.0 test sample unit : mm 20 452 452 bendingdistance unit : mm r340 item speci? cation test method rated zero-power resistance (r 25 ) within the speci? ed tolerance. the value is measured at a power that the in? uence of self-heat generation can be negligible (0.1mw or less), at the rated ambient temperature of 25.00.1c. b value shown in each individual speci? cation. individual speci? cation shall specify b 25/50 or b 25/85 . the zero-power resistances; r 1 and r 2 , shall be measured respectively at t 1 (deg.c) and t 2 (deg.c). the b value is calculated by the following equation. b t 1 /t 2 = k n (r 1 )? k n (r 2 ) 1/(t 1 +273.15)?1/(t 2 +273.15) t 1 t 2 b 25/50 25.0 0.1 c 50.0 0.1 c b 25/85 25.0 0.1 c 85.0 0.1 c adhesion the terminal electrode shall be free from peeling or signs of peeling. applied force : size 0402, 0603 : 5 n duration : 10 ssize : 0402 size : 0603 bending strength there shall be no cracks and other mechanical damage.r 25 change : within 5 % bending distance : 2 mm bending speed : 1 mm/s resistance to vibration there shall be no cracks and other mechanical damage. r 25 change : within 2 % b value change : within 1 % solder samples on a testing substrate, thenapply vibration to them. acceleration : 5 g vibrational frequency : 10 to 2000 hz sweep time : 20 minutes 12 cycles in three directions, which are perpendicular to each other resistance to impact there shall be no cracks and other mechanical damage. r 25 change : within 2 % b value change : within 1 % solder samples on a testing substrate, then apply impacts to them. pulse waveform : semisinusoidal wave, 11 ms impact acceleration : 50 g impact direction : x-x', y-y', z-z' in 6 directions, three times each speci cation and test method jan. 2018 04 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) item speci? cation test method resistance to soldering heat there shall be no cracks and other mechanical damage. r 25 change : within 2 % b value change : within 1 % soldering bath method solder temperature : 260 5 c, 270 5 c dipping period : 3.0 0.5 s, 10.0 0.5 s preheat condition : step temp (c) period (s) 1 80 to 100 120 to 180 2 150 to 200 120 to 180 solderability more than 95 % of the soldered area of both terminal electrodes shall be covered with fresh solder. soldering bath method solder temperature : 230 5 c dipping period : 4 1 s solder : sn-3.0ag-0.5cu temperature cycling r 25 change : within 2 % b value change : within 1 % conditions of one cycle step 1 : ?553 c, 303 min.step 2 : room temp., 3 min. max. step 3 : 1255 c, 303 min. step 4 : room temp., 3 min. max. number of cycles: 2000 cycles humidity r 25 change : within 2 % b value change : within 1 % temperature : 85 2 c relative humidity : 85 5 % test period : 2000 +48/0 h biased humidity r 25 change : within 2 % b value change : within 1 % temperature : 85 2 c relative humidity : 85 5 % applied power : 10 mw(d.c.) test period : 2000 +48/0 h low temperature exposure r 25 change : within 2 % b value change : within 1 % temperature : ?40 3 c test period : 2000 +48/0 h high temperature exposure 1 r 25 change : within 2 % b value change : within 1 % temperature : 125 3 c test period : 2000 +48/0 h high temperature exposure 2 r 25 change : within 3 % b value change : within 2 % temperature : 150 3 c test period : 1000 +48/0 h speci cation and test method jan. 2018 04 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) l t w l 1 l 2 e c d a w 2 w 1 b 100 min. vacant position top cover tape 400 min. 160 min. vacant position t 2 chip component feeding hole chip pocket f d 0 p 1 p 2 p 0 tape running direction e f w b a t 1 t 1 p 1 p 2 p 0 tape running direction t 2 chip component feeding hole chip pocket f d 0 a b f w e size code (eia) l w t l 1 , l 2 0 (0402) 1.00.1 0.500.05 0.500.05 0.250.15 1 (0603) 1.600.15 0.80.1 0.80.1 0.30.2 taped end (unit : mm) pitch 2 mm (punched carrier taping) : size 0402 pitch 4 mm (punched carrier taping) : size 0603 symbol abwfep 1 p 2 p 0 f d 0 t 1 t 2 dim. (mm) 1.0 0.1 1.8 0.1 8.0 0.2 3.50 0.05 1.75 0.10 4.0 0.1 2.00 0.05 4.0 0.1 1.5 +0.1 0 1.1 max. 1.4 max. symbol abwfep 1 p 2 p 0 f d 0 t 1 t 2 dim. (mm) 0.62 0.05 1.12 0.05 8.0 0.2 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.0 0.1 1.5 +0.1 0 0.7 max. 1.0 max. (unit : mm) symbol f a f b cdew 1 w 2 dim. (mm) 180 ?3 60.0 +1. 0 13.0 0.5 21.0 0.8 2.0 0.5 9.0 +1. 0 11.4 1.0 0 0 0 size code thickness (mm) kind of taping pitch (mm) quantity (pcs./reel) 0 (0402) 0.5 punched carrier taping 2 10,000 1 (0603) 0.8 4 4,000 dimensions in mm (not to scale) packaging methods minimum quantity / packing unit standard packing quantities reel for taping leader part and taped end leader part part number (size) minimum quantity/ packing unit packing quantity in carton carton l w h (mm) ertj0 (0402) 10,000 200,000 250 200 200 ertj1 (0603) 4,000 80,000 250 200 200 part no., quantity and country of origin are designated on ou ter packages in english. jan. 2018 04 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) 02550 ?25 120100 8060 75 100 125 ambient temperature (c) maximum power dissipation/ rated maximum power dissipation (%) 150 175 4020 0 multilayer ntc thermistors (automotive grade) series: ertj-m handling precautions 1. circuit design 1.1 operating temperature and storage temperature when operating a components-mounted circuit, please be sure to observe the operating temperature range, written in delivery specifications. please remember not to use the product under the condition that exceeds the specified maximum temperature. storage temperature of pcb after mounting thermistors, which is not operated, should be within the specified storage temperature range in the delivery specifications. 1.2 operating power the electricity applied to between terminals of thermistors should be under the specified maximum power dissipation. there are possibilities of breakage and burn-out due to excessive self-heating of thermistors, if the power exceeds maximum power dissipation when operating. please consider installing protection circuit for your circuit to improve the safety, in case of abnormal voltage application and so on. thermistors performance of temperature detection would be deteriorated if self-heating occurs, even when you use it under the maximum power dissipation. please consider the maximum power dissipation and dissipation factor. safety precautions the multilayer ntc thermistors (automotive grade), hereafter referred to as thermistors, is designed for use in automotive devices. when subjected to severe electrical, environmental, and/or mechanical stress beyond the specifications, as noted in the ratings and specified conditions section, the thermistors performance may be degraded, or become failure mode, such as short circuit mode and open-circuit mode. if you use under the condition of short-circuit, heat generation of thermistors will occur by running large current due to application of voltage. there are possibilities of smoke emission, substrate burn-out, and, in the worst case, fire. for products which require higher safety levels, please carefully consider how a single malfunction can affect your product. in order to ensure the safety in the case of a single malfunction, please design products with fail-safe, such as setting up protecting circuits, etc. for the following applications and conditions, please contact us for product of special specification not found in this document. when your application may have difficulty complying with the safety or handling precautions specified below. high-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as death or injury (regardless of directly or indirectly), due to failure or malfunction of the product. 1 aircraft and aerospace equipment (artificial satellite, rocket, etc.) 2 submarine equipment (submarine repeating equipment, etc.) 3 transportation equipment (airplanes, trains, ship, traffic signal controllers, etc.) 4 power generation control equipment (atomic power, hydroelectric power, thermal power plant control system, etc.) 5 medical equipment (life-support equipment, pacemakers, dialysis controllers, etc.) 6 information processing equipment (large scale computer systems, etc.) 7 electric heating appliances, combustion devices (gas fan heaters, oil fan heaters, etc.) 8 rotary motion equipment 9 security systems j and any similar types of equipment [maximum power dissipation] the maximum power that can be continuously applied under static air at a certain ambient temperature. the maximum power dissipation under an ambient temperature of 25 c or less is the same with the rated maximum power dissipation, and maximum power dissipation beyond 25 c depends on the decreased power dissipation curve below. [dissipation factor] the constant amount power required to raise the temperature of the thermistor 1 c through self heat generation under stable temperatures. dissipation factor (mw/c) = power consumption of thermistor / temperature rise of element decreased power dissipation curve operating conditions and circuit design jan. 2018 01 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) a b c land smd solder resist (a) excessive amount (b) proper amount (c) insuf?cient amount solder resist land portion to be excessively soldered a lead wire of retro-?tted component soldering iron solder (ground solder) chassis electrode pattern solder resist solder resist solder resist the lead wire of a component with lead wires 1.3 environmental restrictions the thermistors shall not be operated and/or stored under the following conditions. (1) environmental conditions (a) under direct exposure to water or salt water (b) under conditions where water can condense and/or dew can form (c) under conditions containing corrosive gases such as hydrogen sulfide, sulfurous acid, chlorine and ammonia (2) mechanical conditions the place where vibration or impact that exceeds specified conditions written in delivery specification is loaded. 1.4 measurement of resistance the resistance of the thermistors varies depending on ambient temperatures and self-heating. to measure the resistance value when examining circuit configuration and conducting receiving inspection and so on, the following points should be taken into consideration: 1 measurement temp : 250.1 c measurement in liquid (silicon oil, etc.) is recommended for a stable measurement temperature. 2 power : 0.10 mw max. 4 terminal measurement with a constant-current power supply is recommended. 2. design of printed circuit board 2.1 selection of printed circuit boards there is a possibility of performance deterioration by heat shock (temperature cycles), which causes cracks, from alumina substrate. please confirm that the substrate you use does not deteriorate the thermistors quality. 2.2 design of land pattern (1) recommended land dimensions are shown below. use the proper amount of solder in order to prevent cracking. using too much solder places excessive stress on the thermistors. unit (mm) size code (eia) component dimensions abc lwt 0(0402) 1.0 0.5 0.5 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5 1(0603) 1.6 0.8 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8 recommended land dimensions (2) the land size shall be designed to have equal space, on both right and left sides. if the amount of solder on both sides is not equal, the component may be cracked by stress, since the side with a larger amount of solder solidifies later during cooling. recommended amount of solder 2.3 utilization of solder resist (1) solder resist shall be utilized to equalize the amounts of solder on both sides. (2) solder resist shall be used to divide the pattern for the following cases; components are arranged closely. the thermistor is mounted near a component with lead wires. the thermistor is placed near a chassis. refer to the table below. prohibited applications and recommended applications item prohibited applications improved applications by pattern division mixed mounting with a component with lead wires arrangement near chassis retro-? tting of component with lead wires lateral arrangement 2.4 component layout to prevent the crack of thermistors, try to place it on the position that could not easily be affected by the bending stress of substrate while mounting procedures or procedures afterwards. placement of the thermistors near heating elements also requires the great care to be taken in order to avoid stresses from rapid heating and cooling. jan. 2018 01 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) a b c e d slit magnitude of stress a>b=c>d>e perforation supporting pin supporting pin crack separation of solder crack (1) to minimize mechanical stress caused by the warp or bending of a pc board, please follow the recommended thermistors layout below. (2) the following layout is for your reference since mechanical stress near the dividing/breaking position of a pc board varies depending on the mounting position of the thermistors. (3) the magnitude of mechanical stress applied to the thermistors when dividing the circuit board in descending order is as follows: push back < slit < v-groove < perforation. also take into account the layout of the thermistors and the dividing/breaking method. (4) when the thermistors are placed near heating elements such as heater, etc., cracks from thermal stresses may occur under following situation: soldering the thermistors directly to heating elements. sharing the land with heating elements. if planning to conduct above-mentioned mounting and/or placement, please contact us in advance. 2.5 mounting density and spaces intervals between components should not be too narrow to prevent the influence from solder bridges and solder balls. the space between components should be carefully determined. 1. storage (1) the thermistors shall be stored between 5 to 40 c and 20 to 70 % rh, not under severe conditions of high temperature and humidity. (2) if stored in a place where humidity, dust, or corrosive gasses (hydrogen sulfide, sulfurous acid, hydrogen chloride and ammonia, etc.) are contained, the solderability of terminal electrodes will be deteriorated. in addition, storage in a places where the heat or direct sunlight exposure occur will cause mounting problems due to deformation of tapes and reels and components and taping/reels sticking together. (3) do not store components longer than 6 months. check the solderability of products that have been stored for more than 6 months before use 2. chip mounting consideration (1) when mounting the thermistors/components on a pc board, the thermistor bodies shall be free from excessive impact loads such as mechanical impact or stress due to the positioning, pushing force and displacement of vacuum nozzles during mounting. (2) maintenance and inspection of the chip mounter must be performed regularly. (3) if the bottom dead center of the vacuum nozzle is too low, the thermistor will crack from excessive force during mounting. the following precautions and recommendations are for your reference in use. (a) set and adjust the bottom dead center of the vacuum nozzles to the upper surface of the pc board after correcting the warp of the pc board. (b) set the pushing force of the vacuum nozzle during mounting to 1 to 3 n in static load. (c) for double surface mounting, apply a supporting pin on the rear surface of the pc board to suppress the bending of the pc board in order to minimize the impact of the vacuum nozzles. typical examples are shown in the table below. item prohibited mounting recommended mounting single surface mouting the supporting pin does not necessarily have to be positioned beneath the thermistor. double surface mounting (d) adjust the vacuum nozzles so that their bottom dead center during mounting is not too low. (4) the closing dimensions of the positioning chucks shall be controlled. maintenance and replacement of positioning chucks shall be performed regularly to prevent chipping or cracking of the thermistors caused by mechanical impact during positioning due to worn positioning chucks. (5) maximum stroke of the nozzle shall be adjusted so that the maximum bending of pc board does not exceed 0.5 mm at 90 mm span. the pc board shall be supported by an adequate number of supporting pins. 3. selection of soldering flux soldering flux may seriously affect the performance of the thermistors. the following shall be confirmed before use. (1) the soldering flux should have a halogen based content of 0.1 wt% (converted to chlorine) or below. do not use soldering flux with strong acid. (2) when applying water-soluble soldering flux, wash the thermistors sufficiently because the soldering flux residue on the surface of pc boards may deteriorate the insulation resistance on the thermistors surface. prohibited layout recommended layout layout the thermistors sideways against the stressing direction precautions for assembly jan. 2018 01 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) time gradualcooling 5 heating 3 peak 4 temp. rise t 2 preheating 1 60 sec max. 60 to 120 sec temperature (c) 260220 180 140 t preheating gradual cooling 60 to 120 sec 3 sec max. 4. soldering 4.1 reflow soldering the reflow soldering temperature conditions are composed of temperature curves of preheating, temp. rise, heating, peak and gradual cooling. large temperature difference inside the thermistors caused by rapid heat application to the thermistors may lead to excessive thermal stresses, contributing to the thermal cracks. the preheating temperature requires controlling with great care so that tombstone phenomenon may be prevented. item temperature period or speed 1 preheating 140 to 180 c 60 to 120 sec 2 temp. rise preheating temp to peak temp. 2 to 5 c /sec 3 heating 220 c min. 60 sec max. 4 peak 260 c max. 10 sec max. 5 gradual cooling peak temp. to 140 c 1 to 4 c /sec recommended proi le of re ow soldering (ex) t : allowable temperature difference t < 150 c the rapid cooling (forced cooling) during gradual cooling part should be avoided, because this may cause defects such as the thermal cracks, etc. when the thermistors are immersed into a cleaning solvent, make sure that the surface temperatures of the devices do not exceed 100 c. performing reflow soldering twice under the conditions shown in the figure above [recommended profile of reflow soldering (ex)] will not cause any problems. however, pay attention to the possible warp and bending of the pc board. 4.2 hand soldering hand soldering typically causes significant temperature change, which may induce excessive thermal stresses inside the thermitors, resulting in the thermal cracks, etc. in order to prevent any defects, the following should be observed. the temperature of the soldering tips should be controlled with special care. the direct contact of soldering tips with the thermistors and/or terminal electrodes should be avoided. dismounted thermistors shall not be reused. (1) condition 1 (with preheating) (a) soldering: use thread solder ( f 1 mm or below) which contains flux with low chlorine, developed for precision electronic equipment. (b) pr eheating: conduct sufficient pre-heating, and make sure that the temperature difference between solder and thermistors surface is 150 c or less. (c) temperature of iron tip: 300 c max. (the required amount of solder shall be melted in advance on the soldering tip.) (d) gradual cooling: after soldering, the thermistors shall be cooled gradually at room temperature. recommended proi le of hand soldering (ex) t : allowable temperature difference t < 150 c (2) condition 2 (without preheating) hand soldering can be performed without preheating, by following the conditions below: (a) soldering iron tip shall never directly touch the ceramic and terminal electrodes of the thermistors. (b) the lands are sufficiently preheated with a soldering iron tip before sliding the soldering iron tip to the terminal electrodes of the thermistors for soldering. conditions of hand soldering without preheating item condition temperature of iron tip 270 c max. wattage 20 w max. shape of iron tip f 3 mm max. soldering time with a soldering iron 3 sec max. 5. post soldering cleaning 5.1 cleaning solvent soldering flux residue may remain on the pc board if cleaned with an inappropriate solvent. this may deteriorate the electrical characteristics and reliability of the thermistors. 5.2 cleaning conditions inappropriate cleaning conditions such as insufficient cleaning or excessive cleaning may impair the electrical characteristics and reliability of the thermistors. (1) insufficient cleaning can lead to: (a) the halogen substance found in the residue of the soldering flux may cause the metal of terminal electrodes to corrode. (b) the halogen substance found in the residue of the soldering flux on the surface of the thermistors may change resistance values. (c) w ater-soluble soldering flux may have more remarkable tendencies of (a) and (b) above compared to those of rosin soldering flux. jan. 2018 01 downloaded from: http:///
design and specifications are each subject to change without notice. ask factory for the current technical specifications before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. multilayer ntc thermistors (automotive grade) supporting pin separated, crack check pin check pin bending torsion pc board splitting jig v-groove pc board outline of jig pc board chipcomponent loadingpoint v-groove loading direction pc board chip component loadingpoint v-groove loading direction floor crack mounted pcb crack (2) excessive cleaning can lead to: (a) when using ultrasonic cleaner, make sure that the output is not too large, so that the substrate will not resonate. the resonation causes the cracks in varistors and/or solders, and deteriorates the strength of the terminal electrodes. please follow these conditions for ultrasonic cleaning: ultrasonic wave output : 20 w/l max. ultrasonic wave frequency : 40 khz max. ultrasonic wave cleaning time : 5 min. max. 5.3 contamination of cleaning solvent cleaning with contaminated cleaning solvent may cause the same results as insufficient cleaning due to the high density of liberated halogen. 6. inspection process the pressure from measuring terminal pins might bend the pcb when implementing circuit inspection after mounting thermistors on pcb, and as a result, cracking may occur. (1) mounted pc boards shall be supported by an adequate number of supporting pins on the back with bend settings of 90 mm span 0.5 mm max. (2) con? rm that the measuring pins have the right tip shape, are equal in height, have the right pressure, and are set in the correct positions. the following figures are for your reference to avoid bending the pc board. item prohibited setting recommended setting bending of pc board 7. protective coating when the surface of a pc board on which the thermistors have been mounted is coated with resin to protect against moisture and dust, it shall be confirmed that the protective coating does not affect the performance of varistors. (1) choose the material that does not emit the decomposition and/or reaction gas. the gas may affect the composing members of the varistors. (2) shrinkage and expansion of resin coating when curing may apply stress to the varistors and may lead to occurrence of cracks. 8. dividing/breaking of pc boards (1) please be careful not to stress the substrate with bending/twisting when dividing, after mounting components including varistors. abnormal and excessive mechanical stress such as bending or torsion shown below can cause cracking in the thermistors. (2) dividing/breaking of the pc boards shall be done carefully at moderate speed by using a jig or apparatus to protect the thermistors on the boards from mechanical damage. (3) examples of pcb dividing/breaking jigs: the outline of pc board breaking jig is shown below. when pc boards are broken or divided, loading points should be close to the jig to minimize the extent of the bending also, planes with no parts mounted on should be used as plane of loading, in order to prevent tensile stress induced by the bending, which may cause cracks of the thermistors or other parts mounted on the pc boards. prohibited dividing recommended dividing 9. mechanical impact (1) the thermistors shall be free from any excessive mechanical impact. the thermistor body is made of ceramics and may be damaged or cracked if dropped. never use a thermistor which has been dropped; their quality may be impaired and failure rate increased. (2) when handling pc boards with thermistors mounted on them, do not allow the thermistors to collide with another pc board. when mounted pc boards are handled or stored in a stacked state, the corner of a pc board might strike thermistors, and the impact of the strike may cause damage or cracking and can deteriorate the withstand voltage and insulation resistance of the thermistor. the various precautions described above are typical. for special mounting conditions, please contact us. other jan. 2018 01 downloaded from: http:///
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